| 摘要 |
PURPOSE: An IC package test apparatus is provided to increase a mounting rate of a PCB by monitoring an IC package without using an additional test point. CONSTITUTION: An IC package test apparatus includes a test kit PCB(130), a test kit PCB connection pad(132), a test pad(134), a male connector pad, a PCB coupled male connector(120), and a PCB coupled female connector(110). The test kit PCB connection pad(132) is formed on an upper face of the test kit PCB(130). The test pad(134) is electrically connected to the test kit PCB connection pad. The test pad is formed on the test kit PCB. The male connector pad is electrically connected to the test kit PCB connection pad. The male connector pad is formed on a lower face of the test kit PCB. The PCB coupled male connector(120) is coupled to the male connector pad. The PCB coupled female connector(110) is coupled to the PCB coupled male connector.
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