Heatsink with heat pipe and fins

摘要

A heat sink (5) includes at least one heat pipe (10) attached to a base (12) having a substantially flat region for interfacing with an electronic component (20). Additionally, the heat sink (5) comprises fins (11, 13) attached to the base (12) and to the at least one heat pipe (10). The fins (11) and the base (12) may be integral with or attached to each other Such a heat sink (5) can dissipate heat from one or more electronic components more efficiently as the heat pipe (10) coupled with the fins (11) attached to the base provide alternate heat transfer paths for heat generated by electronic components (20).