发明名称 Substrate thickness determination
摘要 An apparatus for measuring a thickness of a substrate having an upper surface, without contacting the upper surface of the substrate. A platen having a base surface receives the substrate, and a reference surface is disposed at a known first height from the platen surface. A non contact sensor senses the known first height of the reference surface without making physical contact with the reference surface. The non contact sensor further senses a relative difference between the known first height of the reference surface and a second height of the upper surface of the substrate without making physical contact with the upper surface of the substrate. A controller controls the sensor and determines the thickness of the substrate based at least in part on the known first height of the reference surface and the relative difference between the known first height of the reference surface and the second height of the upper surface of the substrate.
申请公布号 US6710890(B1) 申请公布日期 2004.03.23
申请号 US20030375554 申请日期 2003.02.26
申请人 KLA TENCOR TECH CORP 发明人 KRISHNAN SHANKAR;POHLHAMMER CHRISTOPHER M;GREEN MICHAEL P
分类号 G01B11/06;(IPC1-7):G01B11/06 主分类号 G01B11/06
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