| 摘要 |
A sealing material in a plate form is placed on a frame wherein a recess is provided. A semiconductor chip and the frame are overlapped via the sealing material in a plate form within a thermostatic chamber of which the temperature is higher than the temperature at the time of the sealing of the semiconductor chip and the frame in a resin. After that, the semiconductor chip and the frame, which overlap each other, are taken out of the thermostatic chamber so as to be cooled down in the atmosphere. After that, they are sealed in a molding resin. The semiconductor chip is secured to the frame due to the differential pressure (negative pressure) between the pressure within the airtight space and atmospheric pressure. Thereby, a resin mold semiconductor device is gained wherein a semiconductor chip is secured to a frame without using a die bonding material.
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