| 发明名称 |
Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device |
| 摘要 |
A semiconductor device comprising the bump containing magnetic body, magnetic body, the bump including non-magnetic body for at least partially covering the magnetic body, mixture of magnetic particles and non-magnetic particles and the bump including baked magnetic particles and baked non-magnetic particles.
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| 申请公布号 |
US6709966(B1) |
申请公布日期 |
2004.03.23 |
| 申请号 |
US20000606152 |
申请日期 |
2000.06.29 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HISATSUNE YOSHIMI;SASAKI KEIICHI;IKEGAMI HIROSHI;MATSUO MIE;HAYASAKA NOBUO;OKUMURA KATSUYA |
| 分类号 |
H01L21/60;H01L21/68;H01L21/768;H01L23/485;H05K3/20;H05K3/40;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
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