发明名称 Integrated circuit having oversized components and method of manafacture thereof
摘要 An integrated circuit includes electrical components that include one or more electrical elements on one or more dielectric layers. The electrical element has a geometric shape that exceeds prescribed integrated circuit manufacturing limits in at least one dimension. To achieve compliance with foundry rules, the electrical element is fabricated to include a non-conducting region that negligibly effects the electrical characteristics. The non-conducting region includes a hole, a series of holes, a slot and/or a series of slots spaced within the electrical element at dimensions that are less than the integrated circuit manufacturing limits.
申请公布号 US6709977(B2) 申请公布日期 2004.03.23
申请号 US20020074515 申请日期 2002.02.12
申请人 BROADCOM CORPORATION 发明人 CONTOPANAGOS HARRY;KOMNINAKIS CHRISTOS
分类号 H01L23/522;(IPC1-7):H01L21/44 主分类号 H01L23/522
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