发明名称 Cooling apparatus for electronic unit
摘要 Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.
申请公布号 US6711017(B2) 申请公布日期 2004.03.23
申请号 US20020196284 申请日期 2002.07.17
申请人 HITACHI KOKUSAI ELECTRIC INC.;HITACHI, LTD. 发明人 KUROKAWA TATEKI;SAITO AKIRA;FUKUKAWA TOSHIO;HARADA MIKIO;DAIKOKU TAKAHIRO;YAZAWA HIDEO
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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