WAFER LIFT DEVICE OF SEMICONDUCTOR CHIP FABRICATION EQUIPMENT

摘要

PURPOSE: A wafer lift device of semiconductor chip fabrication equipment is provided to reduce a time for fabrication process and prevent the leakage by controlling only a lift pin to align the lift pin. CONSTITUTION: A wafer lift device of semiconductor chip fabrication equipment includes a wafer stage(210), the first plate(220), a lift pin(230), a piston unit(240), a main body(250), and the second plate(260). A wafer is loaded on an upper surface of the wafer stage(210). A plurality of holes for pin insertion are formed on the wafer stage. The first plate(220) is installed under the wafer stage and includes a plurality of screw holes corresponding to the holes for pin insertion. The lift pin(230) is coupled to the screw holes by the first coupling member. The piston unit(240) is installed under the first plate in order to elevate the first plate. The main body(250) includes an air hole into which the piston is inserted. The second plate(260) is coupled to an upper part of the main body by the second coupling member. A diameter of the screw hole of the first plate is larger than a diameter of the first coupling member. A diameter of the lift pin is larger than the diameter of the screw hole. The first coupling member is formed with a washer coupled to the lift pin.