| 发明名称 |
TIN PLATING METHOD |
| 摘要 |
PURPOSE: Methods of electrodepositing a layer of tin or tin-alloy on a substrate that can provide reduced whisker formation in the deposited film are provided. CONSTITUTION: In a method of electrodepositing a layer of tin or tin-alloy on a substrate, the method comprises the steps of electrolytically treating a substrate with a solution comprising a phosphoric acid and a carboxylic acid; and electrodepositing a layer of tin or tin-alloy on a surface of the treated substrate. In a method of electrodepositing a layer of tin or tin-alloy on a substrate, the method comprises the steps of electrolytically treating a substrate with a solution comprising from 50 to 80% by volume of a carboxylic acid; and electrodepositing a layer of tin or tin-alloy on a surface of the treated substrate.
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| 申请公布号 |
KR20040024523(A) |
申请公布日期 |
2004.03.20 |
| 申请号 |
KR20030063481 |
申请日期 |
2003.09.13 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS L.L.C. |
发明人 |
ZHANG WAN;EGLI ANDRE;HEBER JOCHEN;SCHWAGER FELIX |
| 分类号 |
C25D3/30;C25D3/60;C25D5/10;C25D5/34;C25D7/00;C25D7/12;C25D11/02;C25D11/36;H01L21/288;H01L23/50;H05K3/24;H05K3/34;(IPC1-7):C25D5/10 |
主分类号 |
C25D3/30 |
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