| 摘要 |
FIELD: three-dimensional electronic module manufacture. SUBSTANCE: method for producing three-dimensional module capable of operating under specific external impacts such as enhanced radioactive radiation, open space, nuclear steam generators, intensive electromagnetic radiation and incorporating all advantages of three- dimensional structures includes fixation of chip electronic components on group integrated- circuit board in their respective positions and cutting of integrated-circuit boards from group integrated-circuit board after electrothermal aging and inspection, whereupon boards are glued together to form pack. Upon deposition of conductors onto pack faces fixing compound is removed and components fixed on conductors are placed in shielding enclosure and the latter is filled with heat-conducting and insulating powder which is packed by vibration method. EFFECT: enhanced packing density and reliability, facilitated manufacture, and reduced labor consumption. 16 cl, 5 dwg |
