发明名称 METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, METHOD OF WORKING AND PROCESS FOR PRODUCING THEREOF
摘要 The metallic material consists of an alloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0. 1 to 3. 0% by weight. In the metallic material, Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.
申请公布号 CA2670068(A1) 申请公布日期 2004.03.18
申请号 CA20032670068 申请日期 2003.09.03
申请人 DEPT CORPORATION 发明人 UENO, TAKASHI
分类号 C22C9/00;G02F1/1343;C23C14/34;H01L21/28;H01L21/285;H01L23/498;H01L23/532;H05K1/09 主分类号 C22C9/00
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