| 摘要 |
PROBLEM TO BE SOLVED: To discover an epoxy resin providing a cured product having low water absorptivity and low stress properties, and to provide a semiconductor sealing material having excellent heat resistance to solder and heat cycle resistance, and further having excellent adhesiveness to a polyimide resin film. SOLUTION: The epoxy resin composition contains a polyglycidyl ether compound represented by general formula (I) as the polyepoxy compound. COPYRIGHT: (C)2004,JPO |
