发明名称 |
NITRIDE SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a nitride semiconductor device having an electrode having high barrier height in a Schottky junction with a nitride semiconductor and high adhesion with the nitride semiconductor and a method for manufacturing the nitride semiconductor device. SOLUTION: The method for manufacturing the semiconductor device formed on the nitride semiconductor is provided with a process for forming the electrode 10 on the nitride semiconductor 3 and the electrode forming process is provided with a process for laminating a 1st substance containing a 1st element on the nitride semiconductor, a process for laminating a 2nd substance containing a 2nd element 7a having a work function larger than that of the 1st element on the 1st substance layer and a process for diffusing the 2nd element near a boundary between the nitride semiconductor and the 1st substance by heat treatment. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004087587(A) |
申请公布日期 |
2004.03.18 |
申请号 |
JP20020243549 |
申请日期 |
2002.08.23 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
MIURA NARIHISA;OISHI TOSHIYUKI;FUKITA MUNEYOSHI;ABE YUJI |
分类号 |
H01L21/28;H01L21/338;H01L29/423;H01L29/47;H01L29/778;H01L29/812;H01L29/872;(IPC1-7):H01L29/47 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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