| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-quality and inexpensive electro-optical device equipped with a board where a semiconductor element or an electronic part are mounted through both thermocompression bonding and reflow soldering. SOLUTION: The board where the electronic part is mounted on a coarse-pitch interconnect line pattern through a reflow soldering process (SMT mounting mode) of heating solder to solder the electronic part on the board after the electronic part is mounted on the board with solder and the other board where the electronic part is mounted (COF mounting mode) on a fine pitch interconnect line pattern by thermocompression bonding by the use of ACF are separately prepared. After the electronic parts are mounted on the above boards, the boards are bonded together, so that a fine-pitch terminal part mounted with the semiconductor element on a COF mounting region is hardly contaminated with solder material in SMT mounting, and the board in a COF mounting region is hardly deformed by the high-temperature in reflow soldering. Furthermore, a fine-pitch interconnect line pattern board which is comparatively expensive can be reduced in size to an irreducible minimum. Therefore, by this setup, the electro-optical device that is inexpensive and of high quality can be provided. COPYRIGHT: (C)2004,JPO
|
