| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor package which can have a semiconductor chip, mounted stably when the top diameter of a connection pad is small, and the difference between solder resist height and connection pad height is large when difference is caused by irregularity of solder resist thickness. SOLUTION: The substrate for mounting a semiconductor chip is provided with a connection pad, whose section is trapezoidal corresponding to an electrode of each semiconductor chip, and solder resist, whose aperture part is formed corresponding to each of the connection pads. A top side aperture diameter of each aperture of the solder resist is formed larger than the top diameter of the connection pad. The inside of each aperture of the solder resist is filled with a surface metal plating layer, as far as to the position which is slightly lower than the surface of the solder resist. COPYRIGHT: (C)2004,JPO
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