| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a printed circuit made by plating, in which an initial adhesive strength to a plating layer formed on a heat-resistant film is high, and after thermal loading, adhesive strength after a long-term in stand still under high heat and humidity conditions, and further if the substrate is exposed for a long term under high temperatures or heat and humidity conditions, the substrate has no peal off and has durability. SOLUTION: In the substrate for the printed circuit, a heat-resistant resin layer and a conductive metal layer are sequentially stacked on at least one surface of a heat-resistant insulating film. The heat-resistant resin contains a resin having two or more crosslinked functional groups, and the conductive metal layer contains the plating layer. COPYRIGHT: (C)2004,JPO
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