| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic processing method and device capable of processing a conductive material provided on the surface of a substrate to be flat and further removing (washing) a material stuck on the surface of a substance to be processed such as the substrate while dispensing with CMP treatment itself and reducing the load of the CMP treatment to the upmost for example. SOLUTION: The substrate W is brought into contact or brought close with a plurality of processing electrodes 72, and voltage is applied between the processing electrodes 72 and a power supply electrode 70 supplying power to the substrate W, and fluid is supplied between the substrate W and at least one of the processing electrode 72 or the power supply electrode 70, and the surface of the substrate W is processed by relatively moving the processing electrode 72 and the substrate W so that a plurality of processing electrodes 72 in which the degree of processing per unit time for each electrode are uneven may pass through a point on the surface to be processed of the substrate W. COPYRIGHT: (C)2004,JPO
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