发明名称 |
Electronic device and method for fabricating the electronic device |
摘要 |
A method for fabricating an electronic device includes the steps of: preparing a cavity defining sacrificial layer, at least the upper surface of which is covered with an etch stop layer; forming at least one first opening in the etch stop layer, thereby partially exposing the surface of the cavity defining sacrificial layer; etching the cavity defining sacrificial layer through the first opening, thereby defining a provisional cavity under the etch stop layer and a supporting portion that supports the etch stop layer thereon; and etching away a portion of the etch stop layer, thereby defining at least one second opening that reaches the provisional cavity through the etch stop layer and expanding the provisional cavity into a final cavity.
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申请公布号 |
US2004053435(A1) |
申请公布日期 |
2004.03.18 |
申请号 |
US20030601470 |
申请日期 |
2003.06.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
IKUSHIMA KIMIYA;KOMOBUCHI HIROYOSHI;UCHIDA MIKIYA |
分类号 |
B81B3/00;G01F1/684;G01J5/10;G01J5/20;G01J5/34;(IPC1-7):H01L21/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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