| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device efficiently in high yield, and to provde a device therefor. <P>SOLUTION: A manufacturing line has a device (11) for feeding a hoop substrate (2), a baking furnace (32) for heating and drying the fed hoop substrate (2), a die bonding device (34) for applying an adhesive agent at a prescribed position on the dried hoop substrate (2) and for mounting an IC chip on it and a curing furnace (36) for adhering and fixing the IC chip on the hoop substrate (2) by heating and hardening the adhesive agent. <P>COPYRIGHT: (C)2004,JPO |
