| 摘要 |
PROBLEM TO BE SOLVED: To provide dicing equipment and a chip manufacturing method capable of easily dividing even a thick wafer or a wafer where a so called test pattern, TEG is formed in a street into chips, and preventing any chipping from being generated on the back face. SOLUTION: This dicing equipment 10 is provided with a dicing blade 21 and a laser beam emitting means 31 for emitting a laser beam L from the surface side or back side face of a wafer W to form a reformation area P inside the wafer W, so that dicing can be carried out by combining the blade dicing with the laser dicing. Also, this chip manufacturing method comprises a process for forming a grinding groove GM in the wafer W by the dicing blade 21, a process for forming a scribing groove in the wafer W by a scribing cutter 51, and a process for emitting a laser beam L to the wafer W to form the reformation area P inside. COPYRIGHT: (C)2004,JPO |
