发明名称 THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To provide a thermal head capable of aligning heating elements precisely with a supporting board. SOLUTION: A hard insulating board 20 on which heating elements 2 are formed is placed on a circuit board 21 mounting driving elements and then the circuit board 21 is secured onto a supporting board 22. The side face 20a of the insulating board 20 is located on the inside of the side face 21a of the circuit board 21 which is then abutted against a guide 22a provided on the supporting board 22 thus securing the circuit board 21 onto the the insulating board 20. The circuit board produced by die blanking has a precise side face as compared with the side face of the insulating board produced by dividing and since it has a good linearity in the planar direction, the heating elements and the supporting board can be aligned accurately when the side face of the circuit board is abutted against the guide. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004082506(A) 申请公布日期 2004.03.18
申请号 JP20020246254 申请日期 2002.08.27
申请人 AOI ELECTRONICS CO LTD 发明人 KUBO HIROMOTO
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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