发明名称 METHOD OF MANUFACTURING MEMS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a MEMS (micro electro mechanical system) device without damaging a ribbon member. SOLUTION: A resist mask 56 having a resist pattern having opening parts 54 of a width the same as a width of a ribbon member 19 of the MEMS device at intervals the same as intervals of the ribbon members 19 is formed on a sacrifice layer 24, when a ribbon member forming layer is formed on the sacrifice layer 24 in manufacturing the MEMS device. An upper layer part of the sacrifice layer is etched to form recessed parts 58 of a width the same as the width of the ribbon member at intervals same as the intervals of the ribbon members, and projecting parts 60 of a width the same as the interval of the ribbon members are also formed. The ribbon member forming layer 46 is formed on the whole surface on the sacrifice layer. The CMP treatment is performed on the ribbon member forming layer on the sacrifice layer, and the ribbon member forming layer on the projecting parts of the sacrifice layer, and the projecting parts of the sacrifice layer are abraded to be eliminated. Whereby the ribbon member forming layer can be divided into ribbon members at predetermined intervals with a specific width by performing the patterning to the ribbon member forming layer. Then the sacrifice layer is eliminated by etching similarly as a conventional method, to form the ribbon members. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004082260(A) 申请公布日期 2004.03.18
申请号 JP20020246367 申请日期 2002.08.27
申请人 SONY CORP 发明人 TANIGUCHI TAKESHI
分类号 G02B26/08;B81B3/00;B81C1/00;(IPC1-7):B81C1/00 主分类号 G02B26/08
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