发明名称 Semiconductor wafer and its manufacturing method
摘要 A method of epitaxially growing a SiC film on a Si substrate, including: (a) supplying a raw material gas containing a gas having P (phosphorus) element and a gas having B (boron) element on a Si substrate, and thereby synthesizing an amorphous BP thin film having a thickness of 5 nm or more and 100 nm or less on the Si substrate; (b) further supplying a raw material gas containing a gas having P element and a gas having B element on the Si substrate, and thereby synthesizing a cubic boron phosphide single crystal film having a thickness of 5 nm or more and 1000 nm or less on the Si substrate; and (c) supplying a gas having carbon element and a gas having silicon element on the Si substrate thereon the BP single crystal film is formed, and thereby synthesizing a beta-SiC single crystal film or an amorphous SiC film having a thickness of 1 nm or more and several hundreds nanometers or less on the cubic boron phosphide single crystal film on the Si substrate.
申请公布号 US2004053438(A1) 申请公布日期 2004.03.18
申请号 US20030432597 申请日期 2003.06.03
申请人 ABE YOSHIHISA;SUZUKI SHUNICHI;NAKANISHI HIDEO;TERASHIMA KAZUTAKA;KOMIYAMA JUNO 发明人 ABE YOSHIHISA;SUZUKI SHUNICHI;NAKANISHI HIDEO;TERASHIMA KAZUTAKA;KOMIYAMA JUNO
分类号 C30B25/02;H01L21/04;(IPC1-7):H01L21/00;H01L21/20;H01L21/336 主分类号 C30B25/02
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