SILICON SUBSTRATE DEVICE AND ITS MANUFACTURING METHOD

摘要

A first micro-width rectangular groove having a rectangular cross-section, and a second micro-width rectangular groove having a rectangular cross-section and being substantially orthogonal to the first micro-width rectangular groove are made in a first silicon substrate. A third micro-width rectangular groove having a rectangular cross-section is made oppositely to the first micro-width rectangular groove in a second silicon substrate. An element substrate provided with a frequency converting element is disposed in the second micro-width rectangular groove such that the frequency converting element is located at the perpendicularly intersecting part of the first and second micro-width rectangular grooves. Furthermore, the first silicon substrate provided with the element substrate and the second silicon substrate are pasted together such that the first and third micro-width rectangular grooves face each other thus forming a rectangular waveguide comprising the first and third micro-width rectangular grooves and propagating a high frequency receiving signal before it is beamed to the frequency converting element.