PRINTED CIRCUIT BOARD CAPABLE OF BONDING DIFFERENT WIRE EACH OTHER AND SEMICONDUCTOR POWER MODULE USING THE SAME

摘要

PURPOSE: A printed circuit board(PCB) capable of bonding different wire each other is provided to simultaneously perform an aluminum wire bonding process and a gold wire bonding process by dividing a PCB into an aluminum wire bonding region and a gold wire bonding region and by making both regions have different section structures proper for bonding aluminum and gold wires. CONSTITUTION: An insulation substrate(210) has the first region to which the aluminum wire is bonded and the second region to which the gold wire is bonded. A copper layer(220) is formed on the first and second regions of the insulation substrate. The first nickel layer(230) is formed on the copper layer. The first gold layer(240) is formed on the first nickel layer. The second nickel layer(250) is formed only on the first gold layer in the second region. The second gold layer(260) is formed on the second nickel layer.