| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant porous resin multilayer substrate of a small dielectric loss tangent, high strength, and a small thermal expansion. SOLUTION: The heat-resistant porous resin multilayer substrate comprises an adhesive, a heat-resistant porous resin film laminated via the adhesive, and a conductive layer formed on both surfaces or either one surface of the heat-resistant porous resin film. The adhesive is a low dielectric loss tangent resin composition which contains a bridge principle of≤100 weight average molecular weight having a plurality of styrene groups shown by a general formula (wherein, R is a hydrocarbon skeleton, R<SP>1</SP>is the same or equal and is a hydrogen atom or hydrocarbon radical of 1 to 20 carbon numbers, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>can be the same or different and are hydrogen atoms or alkyl radical of 1 to 6 carbon numbers, (m) is an integer of 1 to 4, and (n) is an integer of≥2), and which contains a high molecular weight body. COPYRIGHT: (C)2004,JPO |
