| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for fixing a circuit board by which the circuit board is mounted and fixed with a stable suction, and to provide a method for manufacturing a multilayer wiring board. <P>SOLUTION: A connecting board and a board to be connected, on which a conductor circuit, or a conductor circuit and a conductor part are formed, are mounted on a pressurizing stage with electrostatic force, respectively, and then lamination by aligning is performed under a decompressed atmosphere to pressurize, in this method for manufacturing the circuit board. The connecting board and the board to be connected are mounted on the pressurizing stage under the decompressed atmosphere. Under the atmosphere, an adhesives layer is formed. <P>COPYRIGHT: (C)2004,JPO</p> |
