SPHERICAL SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a spherical semiconductor device that can secure an etching performance through a small number of steps, and to provide a method of manufacturing the device.

SOLUTION: The spherical semiconductor device 11 has a spherical semiconductor 13 which is provided on a glass wiring board 12 and electrically connected to the board 12 and an outer shell section 14 surrounding the semiconductor 13. The outer shell section 14 has a structural film 20. The film 20 is formed by thermally compressing the spherical particles or powder of a synthetic resin and has a crest-like embedding section 20c covering the periphery of the spherical semiconductor 13 and a peripheral adhesive section 20d extended from the foot of the embedding section 20c to the periphery and bonded to the surface of the glass wiring board 12. Fine holes are formed in at least part of the embedding section 20c.

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