| 摘要 |
PROBLEM TO BE SOLVED: To improve the working environment by requiring no replacement of a solvent, to realize shortening of the lead time and a labor-saving and to further reduce stain of the chip electronic part after drying. SOLUTION: The equipment is provided with a supersonic washing part 2 for accommodating chip electronic parts in a perforated container 10 to carry out supersonic washing; a dehydration drying part 3 for carrying out dehydration/drops-removal and hot air drying by air suction against the chip electronic parts accommodated in the punched container 10 after completion of supersonic washing; and a drying cooling part 4 for drying/cooling the chip electronic parts by air blasting after completion of the dehydration/drops-removal and hot air drying. It is controlled in the supersonic washing part 2 such that conductivity of washing water does not exceed a specified value, for example, 2μS/cm. COPYRIGHT: (C)2004,JPO
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