发明名称 Electroless copper plating of ferrous metal substrates
摘要 The present invention provides a continuous wire drawings process, wherein ferrous metal is drawn through multiple dies, in which the wire is coated in-line in an electroless coppering step between two wire drawing stages by being passed through a bath using transport means comprising ferrous metal components which contact solution in the bath, the bath containing an aqueous solution containing copper ions, bromide ions, a water soluble lubricant and an inhibitor compound such that a coating of copper is deposited on to the ferrous metal surface. A treatment composition as well as dry and liquid concentrate compositions are also described.
申请公布号 US2004052961(A1) 申请公布日期 2004.03.18
申请号 US20030451941 申请日期 2003.06.26
申请人 BROWN KEVIN;POVER HEBERT TREVOR 发明人 BROWN KEVIN;POVER HEBERT TREVOR
分类号 C23C18/16;C23C18/38;(IPC1-7):B05D1/18;C23C18/32;C10M101/00 主分类号 C23C18/16
代理机构 代理人
主权项
地址