FLIP CHIP RESISTOR AND ITS MANUFACTURING METHOD

摘要

The present invention provides for a flip chip resistor (40) having a substrate (12) having opposite ends, a pair of electrodes formed from a first electrode layer (16) disposed on the opposite ends of the substrate (12), a resistance layer (14) electrically connecting the pair of electrodes (16), a protective layer (22) overlaying the resistance layer (14), and a second electrode layer (18) overlaying the first electrode layer (16) and at least a portion of the protective layer (18). The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size. A method of the present invention provides for manufacturing flip chip resistors by applying a first electrode layer (16) to a substrate (12) to create at least one pair of opposite electrodes(16), applying a resistance layer (14) between each pair of opposite electrodes (16); applying a first protective layer (20) at least partially overlaying the resistance layer (14), applying a second protective layer (22) at least partially overlaying at least a portion of the resistance layer (14), and applying a second electrode layer (18) overlaying the first electrode layer (16) and at least a portion of the second protective layer (22).