发明名称 APPARATUS AND PROCESS FOR MANUFACTURING SOLDER BALLS
摘要 An apparatus and method of forming fluxless solder balls includes forming solder balls from a supply of solder. A coating is formed on the solder balls for limiting naturally occurring oxide growth on the solder balls before significant natural oxide growth on the solder balls has occurred. The coating allows the solder balls to be soldered without using flux.
申请公布号 WO2004023523(A2) 申请公布日期 2004.03.18
申请号 WO2003US27643 申请日期 2003.09.04
申请人 MASSACHUSETTS INSTITUTE OF TECHNOLOGY;FOULKE, RICHARD, F.;CHUN, JUNG-HOON;ALVAREZ, JUAN, C., R.;SAKA, NANNAJI 发明人 FOULKE, RICHARD, F.;CHUN, JUNG-HOON;ALVAREZ, JUAN, C., R.;SAKA, NANNAJI
分类号 B22F1/02;B23K35/02;B23K35/36;H05K3/28;H05K3/34 主分类号 B22F1/02
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