APPARATUS AND PROCESS FOR MANUFACTURING SOLDER BALLS
摘要
An apparatus and method of forming fluxless solder balls includes forming solder balls from a supply of solder. A coating is formed on the solder balls for limiting naturally occurring oxide growth on the solder balls before significant natural oxide growth on the solder balls has occurred. The coating allows the solder balls to be soldered without using flux.
申请公布号
WO2004023523(A2)
申请公布日期
2004.03.18
申请号
WO2003US27643
申请日期
2003.09.04
申请人
MASSACHUSETTS INSTITUTE OF TECHNOLOGY;FOULKE, RICHARD, F.;CHUN, JUNG-HOON;ALVAREZ, JUAN, C., R.;SAKA, NANNAJI