| 摘要 |
A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R<1 >represents an alkyl group having a carbon number in the range of 1 to 3. R<2>, R<3>, R<4>, and R<5 >each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.
|
