| 摘要 |
PURPOSE: To improve adhesiveness of a mounting structure and electric reliability by disposing a resin member with no defects such as cracking between a substrate and a wiring board, related to the substrate, a method for forming a solder ball, and a mounting structure thereof if the solder ball is formed on an electrode pad provided on the substrate, which is mounted on the mounting board. CONSTITUTION: The opening part of a film-like solder resist 81 formed on a semiconductor chip 103 is filled with a solder paste containing solder and thermo-setting resin 171, which is thermally processed to provide a solder ball 161 and the thermo-setting resin 171 between a semiconductor substrate 61 and the solder ball. By thermally processing the semiconductor chip 103 and a wiring board 140 for flip-chip mounting, the thermo-setting resin 171 with no defects such as cracking is so disposed as to cover the wiring layer 151 and a part of the wiring substrate 140. |
