SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a solid-state imaging device that is easy to manufacture and has high reliability. SOLUTION: This invention includes a semiconductor substrate 101 with a solid-state imaging device formed and a transmissive member 201 that is attached onto the surface of the semiconductor substrate in such a manner as to oppose to the light receiving region of the solid-state imaging device with a gap. External connecting terminals are arranged on the surface opposed to the surface on which the solid-state imaging device is formed of the semiconductor substrate 101, and the external connecting terminals are connected to the solid-state imaging device via a through hole that is arranged in the semiconductor substrate 101. COPYRIGHT: (C)2004,JPO