发明名称 SPUTTERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a sputtering system which can suppress the generation of particles even when sputtering is performed by using targets consisting of carbon, gold, etc. SOLUTION: The sputtering system is provided with a stage 12 which is disposed within a deposition chamber 10 and is used to be placed on with a sample 14 and clamps 16 which fix the sample placed on the stage to the stage and a cylindrical shield 26 which is disposed on the circumferences of the clamps and are formed to cover the under surface side of the peripheral edges of the clamps. Clearances 28 are formed between the end of the shield and the clamps and a plurality of finned bodies 20a to 20c for catching the sputter particles included in the gas leaking outside of the shield through the clearances are formed within the regions between the clearances and the peripheral edges of the clamps. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004083984(A) 申请公布日期 2004.03.18
申请号 JP20020245720 申请日期 2002.08.26
申请人 FUJITSU LTD 发明人 HASEGAWA TAKASHI;HIGUCHI TORU
分类号 C23C14/34;H01L21/285;(IPC1-7):C23C14/34 主分类号 C23C14/34
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