发明名称 SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a sputtering target which does not occur arcing, permits stable deposition, and obviates the occurrence of nodules and the deterioration of the quality of a substrate, etc., by particles. SOLUTION: The sputtering target is formed by joining a target material composed of a plurality of divided target materials and a backing plate by means of a bonding material. Horizontal portions having a thickness approximately the same as the thickness of the divided target materials of a smaller thickness are formed in the adjacent portions of the divided target materials of a larger thickness among the divided target materials, and inclined portions continuous with the upper target surfaces from the horizontal portions are formed on the divided target materials of the larger thickness. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004083985(A) 申请公布日期 2004.03.18
申请号 JP20020245729 申请日期 2002.08.26
申请人 MITSUI MINING & SMELTING CO LTD 发明人 ONO NAOKI
分类号 C23C14/34;H01L21/203;(IPC1-7):C23C14/34 主分类号 C23C14/34
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