| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid-sealing material having high productivity without needing to previously prepare a film and a frame body, not lowering productivity and capable of lowering cost, compared with a case when using an underfill material. SOLUTION: The present invention relates to the liquid-sealing material for sealing a space 5 formed between a chip carrier 1 on which a semiconductor chip 2 is mounted and the semiconductor chip 2. In the liquid sealing material, the specific gravity is kept to≤1.5 and the thixotropic index is kept to≥2.0 by compounding a liquid resin with a filler. As a result, a package free from unevenness can be obtained on the surface of the cured product and the space 5 can be sealed by carrying out nearly the same operation as the underfill material and permeation up to the deep part of the space 5 can be prevented. COPYRIGHT: (C)2004,JPO
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