发明名称 |
NON-VOLATILE MEMORY DEVICE WITH SELECT TRANSISTOR STRUCTURE AND SILICON-OXIDE-NITRIDE-OXIDE-SILICON CELL STRUCTURE AND FABRICATING METHOD THEREOF |
摘要 |
PURPOSE: A non-volatile memory(NVM) device with a select transistor structure and a silicon-oxide-nitride-oxide-silicon(SONOS) cell structure is provided to perform the program operation of a byte unit through a proper circuit connection unit by controlling the program operation in a SONOS cell by a select transistor. CONSTITUTION: A semiconductor substrate(200) is prepared. A source region(202) and a drain region(204) are formed in a predetermined upper region of the semiconductor substrate, separated from each other. An impurity region(206) of a floating state is formed in a predetermined upper region of the semiconductor substrate between the source region and the drain region. A vertical structure(210) where a tunneling layer(212), a charge trapping layer(214) and a blocking layer(216) are sequentially formed is disposed in the first region on the semiconductor substrate between the source region and the impurity region. A control gate insulation layer(222) is disposed between the source region and the impurity region, adjacent to the vertical structure. A control gate electrode(232) is formed on the vertical structure and the control gate insulation layer. A gate insulation layer(224) is formed on the semiconductor substrate between the impurity region and the drain region. A gate electrode(234) is formed on the gate insulation layer.
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申请公布号 |
KR20040023295(A) |
申请公布日期 |
2004.03.18 |
申请号 |
KR20020055003 |
申请日期 |
2002.09.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN, JEONG UK;KANG, SEONG TAEK;KIM, SEONG GYUN |
分类号 |
H01L21/8247;H01L21/28;H01L21/336;H01L21/8246;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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