发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent a high-frequency signal from attenuating in a multilayer wiring board, having a high-frequency transmission part for transmitting a high frequency by wiring conductor layers which are arranged facing each other, interposing an insulating layer between the conductor layers. SOLUTION: The high-frequency transmission part transmits high-frequency signals with the wiring conductor layers 2 which are arranged facing each other, interposing the insulating layer 3 between the layers 2. Concerning the facing surfaces of the wiring conductor layers 2, the surface resistance containing the influence of unevenness of the surface facing the surface resistance, is made at least 1.5 times with respect to the surface resistance due to the skin effect, with respect to the high-frequency signal. The transmission loss of the high-frequency signal can be reduced, and the multilayer wiring board having superior high-speed transmission properties is obtained. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004087928(A) 申请公布日期 2004.03.18
申请号 JP20020248712 申请日期 2002.08.28
申请人 KYOCERA CORP 发明人 KAWAMURA GENSHITAROU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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