| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of packing a tape carrier for a semiconductor device by which the processing of a sheet-like tape can be made smooth in a manufacturing process at a deliver destination by reducing the warping of the tape at the time of shipping the tape. SOLUTION: The method of packing the tape carrier for the semiconductor device includes a first step of forming sheet-like tape carriers 1a by cutting a tape carrier into sheets having a prescribed length, a second step of reducing the warping of the tape carriers 1a by drying the carriers 1a while the carriers 1a are pressed down to become flat or holding the carriers 1a so that circuit wiring patterns 3 may be protruded, and a third step of packing the tape carriers 1a reduced in warping through drying in the second step by enclosing the carriers 1a in a packing bag 8 in a short time so that the carriers 1a may warp again. COPYRIGHT: (C)2004,JPO
|
