| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact metallized film capacitor whose temperature rise is low, whose serial connection is not necessary, and whose application is available with a high voltage, and to manufacture large variety with small kinds of materials. SOLUTION: Depositing faces are overlapped with each other so that large current resistivity can be obtained, films are rolled round in piles so that high voltage resistivity can be obtained, and films with different thickness are overlapped so that even the limited kinds of film thickness can meet the variety of voltages with their combination. COPYRIGHT: (C)2004,JPO
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