| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition excellent in reflow crack resistance and an electronic component device sealed therewith. SOLUTION: The sealing resin composition essentially consists of (A) an epoxy resin, (B) a phenolic resin, (C) a triphenyl-skeleton-containing silane compound, and (D) an inorganic filler. The content of the component (C) is 0.05-5.0 wt.% based on the entire resin composition. The content of the component (D) is 70-95 wt.% based on the entire resin composition. COPYRIGHT: (C)2004,JPO
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