| 摘要 |
PROBLEM TO BE SOLVED: To well reproducibly prevent peeling of deposition materials stuck to parts during a deposition step even when high-stress films etc., are deposited by a vacuum deposition system. SOLUTION: The parts 1 for the vacuum deposition system include the bodies 2 of the system components and thermally sprayed Cu alloy films which are formed on the surfaces of the component bodies 2 and contain≤20 mass% Al and the balance mainly comprising Cu. The thermally sprayed Cu alloy films 3 are formed with oxygen-containing regions X on the surface side and the ratio (To/Tm) of the depth To of the oxygen-containing regions to a thickness Tm of the films 3 is controlled to a range from 0.05 to 0.4. The vacuum deposition system, such as a sputtering system, includes such components 1 in the form of holding sections for samples to be deposited with the films, holding sections for deposition sources, and deposition protecting components, etc. COPYRIGHT: (C)2004,JPO
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