FLAME-RETARDANT EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in fluidity, flame retardance and moisture resistance and forming a cured product not having undesirable influence on the environment and a resin sealing type semiconductor device excellent in reliability. SOLUTION: The flame-retardant epoxy resin composition is obtained by compounding (a) an epoxy resin component composed of (a-1) 5-90 wt.% epoxy resin having≥95 wt.% content of bisphenol A diglycidyl ether represented by the formula and (a-2) 95-10 wt.% epoxy resin having a specific chemical structure with (b) a curing agent and (c) an inorganic filler. A semiconductor element and the semiconductor device are each sealed with the resin composition. COPYRIGHT: (C)2004,JPO