| 摘要 |
PROBLEM TO BE SOLVED: To provide unleaded solder which does not contain lead in a composition to be joined to materials to be joined of inorganic nonmetals, such as glass and ceramics. SOLUTION: The unleaded solder consists of tin or an alloy of the tin and indium as a main component and contains zinc, antimony and aluminum as additive components and is joined to the materials to be joined of the inorganic nonmetals by chemical bonding with oxygen as a medium and to the materials to be joined of the metals by diffusion bonding or chemical bonding with the oxygen as the medium. COPYRIGHT: (C)2004,JPO
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