| 摘要 |
<p>Two substrate ]eaves are coupled by a folded flexible circuit medium. Integrated circuit components can be mounted to opposite faces of both leaves. A signal terminal projects from one of the leaves. Both leaves include paths for communicating signals between their respective components and the terminal. Preferably the leaves are formed by two outer, rigid substrates each laminarly affixed to a respective inner substrate, the inner substrates being separate sections of the folded circuit medium and the outer substrates being separated sections of a rigid circuit medium. Components are mounted to the exposed faces of the substrates. The fold includes paths for communicating signals between the leaf distal from the terminal and the terminal, the signal paths between one leaf and the terminal being closely matched in length and impedance to corresponding paths between the other leaf and the terminal. [</p> |
