BOARD PROCESSING METHOD, DEVICE, AND OPEN PLATE USED FOR IT

摘要

PROBLEM TO BE SOLVED: To provide a method of efficiently and uniformly forming irregularities on the surface of a board or the like used for a solar cell.

SOLUTION: The board processing method is carried out in such a manner wherein an open plate 13 where a large number of openings 14 are provided is installed at a surface side of a board 1 to be processed, and the surface of the board 1 is roughed by dry etching. The openings 14 provided to the open plate 13 are each formed into a shape that enables only a virtual column whose diameter is half or below as long as a distance between the open plate 13 and the surface of the board 1 to be processed to pass through the opening 14.

COPYRIGHT: (C)2004,JPO