| 摘要 |
PROBLEM TO BE SOLVED: To obtain an ultraviolet curing type low-modulus resin composition suitably used for protecting a charge-coupling detector from the exterior environment and exhibiting excellent sealability. SOLUTION: A thermoplastic resin composition for vacuum forming is characterized as comprising (a) a liquid epoxy resin in an amount of≥90 and≤99.5 wt.% based on the total amount of an organic component, (b) a phenolic hydroxy group-containing aromatic polyamide-polybutadiene/acrylonitrile block copolymer in an amount of≥0.5 and≤5 wt.% based on the total amount of the organic component, (c) an inorganic filler and (d) a photocationic polymerization initiator. The sealability of the composition is excellent and a sealing material using the composition has excellent airtight sealability even after exposure to thermal history. COPYRIGHT: (C)2004,JPO
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