| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high thermal expansion low temperature fired porcelain which does not show an inflection point on a curve of the coefficient of thermal expansion in a temperature range of 40-400°C, and has an improved chemical resistance and a low dielectric constant, a multilayered wiring board formed by using the high thermal expansion porcelain, and a mounting structure having excellent long-term stability. <P>SOLUTION: The high thermal expansion porcelain is obtained by firing the high thermal expansion porcelain formulation containing glass including SrO, and filler. The filler contains 20-99 mass % metal oxide having a coefficient of thermal expansion in a temperature range of 40-400°C of ≥6×10<SP>-6</SP>/°C and 1-80 mass % cordierite. At least one layer of the ceramic insulating layers 1a, 1b of the multilayered wiring board is formed from the high thermal expansion porcelain. <P>COPYRIGHT: (C)2004,JPO |
